This International Standard lists test methods applicable to semiconductor devices (discrete devices and integrated circuits) from which a selection may be made. However, additional test methods may be required for non-cavity devices.
NOTE A non-cavity device is a device in which enclosing or encapsulating material is in intimate contact with all exposed surfaces of the active element, and no void space is included in the device design.
This standard has taken into account, wherever possible, IEC 60068.
The object of this standard is to establish uniform preferred test methods with preferred values for stress levels for judging the environmental properties of semiconductor devices.
In case of contradiction between this standard and a relevant specification, the latter shall govern.
IEC 60749:2002 history
2002IEC 60749:2002 Semiconductor devices - Mechanical and climatic test methods
1970IEC 60749:1996/AMD2:2001 Amendment 2 - Semiconductor devices - Mechanical and climatic test methods
1970IEC 60749:1996/AMD1:2000 Amendment 1 - Semiconductor devices - Mechanical and climatic test methods
1996IEC 60749:1996 Semiconductor devices - Mechanical and climatic test methods
1970IEC 60749:1984/AMD2:1993 Amendment 2 - Semiconductor devices - Mechanical and climatic test methods.
1970IEC 60749:1984/AMD1:1991 Amendment 1 - Semiconductor devices - Mechanical and climatic test methods.
1984IEC 60749:1984 Semiconductor devices. Mechanical and climatic test methods