IEC 60749-11:2002
Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature; Two-fluid-bath method
- Standard No.
- IEC 60749-11:2002
- Release Date
- 2002
- Published By
- International Electrotechnical Commission (IEC)
- Status
- Replace By
- IEC 60749-11:2002/COR1:2003
- Latest
- IEC 60749-11:2002/COR2:2003
- Replace
- IEC 47/1535A/CDV:2000 IEC 47/1605/FDIS:2002 IEC 60749:1996 IEC 60749 AMD 1:2000 IEC 60749 AMD 2:2001 IEC 60749 Edition 2.2:2002 IEC/PAS 62185:2000
- Scope
- This part of IEC 60749 defines the rapid change of temperature test method and the two-fluid-bath method. When both test methods are performed as part of a device qualification, results of air to air temperature cycling take priority over this two-fluid-bath test method. This test method may also be used, employing fewer cycles (e.g. 5 to 10 cycles), to test the effect of immersion in heated liquids that are used for the purpose of cleaning devices. This test is applicable to all semiconductor devices. It is considered destructive unless otherwise detailed in the relevant specification. In general, this rapid change of temperature and two-fluid bath method test is in conformity with IEC 60068-2-14 but, due to specific requirements of semiconductors, the clauses of this standard apply.
IEC 60749-11:2002 history
- 2003 IEC 60749-11:2002/COR2:2003 Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature; Two-fluid-bath method; Corrigendum 2
- 2003 IEC 60749-11:2002/COR1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature; Two-fluid-bath method
- 2002 IEC 60749-11:2002 Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature; Two-fluid-bath method
