IEC 60749-3:2002
Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination

Standard No.

IEC 60749-3:2002

Release Date

2002

Published By

International Electrotechnical Commission (IEC)

Status

Be replaced

Replace By

IEC 60749-3:2002/COR1:2003

Latest

IEC 60749-3:2017

Replace

IEC 47/1531A/CDV:2000 IEC 47/1596/FDIS:2002 IEC 60749:1996 IEC 60749 AMD 2:2001 IEC 60749 Edition 2.2:2002 IEC/PAS 62163:2000

Scope

The purpose of this part of IEC 60749 is to verify that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual inspection is a non-destructive test and applicable for all package types. The test is useful for qualification, process monitor, or lot acceptance, or both.

IEC 60749-3:2002 history

• 2017 IEC 60749-3:2017 Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination
• 2003 IEC 60749-3:2002/COR1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination
• 2002 IEC 60749-3:2002 Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination

IEC 60749-3:2002 Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination has been changed from IEC 60749:1996 Semiconductor devices - Mechanical and climatic test methods.