IEC 60749-31:2002 Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced)
This part of IEC 60749 is applicable to semiconductor devices (discrete devices and integrated circuits).
The object of this test is to determine whether the device ignites due to internal heating caused by excessive overloads.
NOTE This test is identical to the test method contained in 1.1 of chapter 4 of IEC 60749 (1996), apart from changes to this clause, the addition of titles to clauses 2 and 3 and renumbering.
IEC 60749-31:2002 history
2003IEC 60749-31:2002/COR1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced)
2002IEC 60749-31:2002 Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced)