IEC 60749-22:2002
Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength

Standard No.

IEC 60749-22:2002

Release Date

2002

Published By

International Electrotechnical Commission (IEC)

Status

Be replaced

Replace By

IEC 60749-22:2002/COR1:2003

Latest

IEC 60749-22:2002/COR1:2003

Replace

IEC 47/1394/FDIS:1996 IEC 47/1477/FDIS:2000 IEC 60749:1996 IEC 60749 AMD 1:2000 IEC 60749 AMD 2:2001 IEC 60749 Edition 2.2:2002

Scope

Applicable to semiconductor devices (discrete devices and integrated circuits), this test measures bond strength or determine compliance with specified bond strength requirements

IEC 60749-22:2002 history

• 2003 IEC 60749-22:2002/COR1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength
• 2002 IEC 60749-22:2002 Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength