IEC 60749-8:2002
Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
- Standard No.
- IEC 60749-8:2002
- Release Date
- 2002
- Published By
- International Electrotechnical Commission (IEC)
- Status
- Replace By
- IEC 60749-8:2002/COR1:2003
- Latest
- IEC 60749-8:2002/COR2:2003
- Replace
- IEC 47/1574/FDIS:2001 IEC 60749:1996 IEC 60749 AMD 1:2000 IEC 60749 AMD 2:2001 IEC 60749 Edition 2.2:2002
- Scope
- This part of IEC 60749 is applicable to semiconductor devices (discrete devices and integrated circuits) The object of this test method is to determine the leak rate of semiconductor devices. NOTE This test is identical to the test method contained in clause 5 of chapter 3 of IEC 60749 (1996), amendment 2, apart from the addition of this clause and clause 2 and the subsequent renumbering.
IEC 60749-8:2002 history
- 2003 IEC 60749-8:2002/COR2:2003 Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
- 2003 IEC 60749-8:2002/COR1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
- 2002 IEC 60749-8:2002 Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
IEC 60749-8:2002 Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing has been changed from IEC 60749:1996 Semiconductor devices - Mechanical and climatic test methods.
