IEC 60749-4:2002
Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)

Standard No.

IEC 60749-4:2002

Release Date

2002

Published By

International Electrotechnical Commission (IEC)

Status

Be replaced 2017-03

Replace By

IEC 60749-4:2002/COR1:2003

Latest

IEC 60749-4:2017

Replace

IEC 47/1532A/CDV:2000 IEC 47/1602/FDIS:2002 IEC 60749:1996 IEC 60749 AMD 1:2000 IEC 60749 AMD 2:2001 IEC 60749 Edition 2.2:2002 IEC/PAS 62177:2000

Scope

This part of IEC 60749 provides a highly accelerated temperature and humidity stress test (HAST) for the purpose of evaluating the reliability of non-hermetic packaged semiconductor devices in humid environments.

IEC 60749-4:2002 history

• 2017 IEC 60749-4:2017 Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
• 2003 IEC 60749-4:2002/COR1:2003 Semiconductor Devices - Mechanical and Climatic Test Methods - Part 4: Damp Heat@ Steady State@ Highly Accelerated Stress Test (HAST) CORRIGENDUM 1 (Edition 1.0)
• 2002 IEC 60749-4:2002 Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)

IEC 60749-4:2002 Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST) has been changed from IEC 60749:1996 Semiconductor devices - Mechanical and climatic test methods.