IEC 60749-10:2002
Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock
- Standard No.
- IEC 60749-10:2002
- Release Date
- 2002
- Published By
- International Electrotechnical Commission (IEC)
- Status
- Replace By
- IEC 60749-10:2002/COR1:2003
- Latest
- IEC 60749-10:2022
- Replace
- IEC 47/1598/FDIS:2002 IEC 60749:1996 IEC 60749 AMD 1:2000 IEC 60749 AMD 2:2001 IEC 60749 Edition 2.2:2002 IEC/PAS 62186:2000
- Scope
- This part of IEC 60749 describes a shock test intended to determine the suitability of component parts for use in electronic equipment which may be subjected to moderately severe shocks as a result of suddenly applied forces or abrupt changes in motion produced by rough handling, transportation, or field operation. Shock of this type may disturb operating characteristics, particularly if the shock pulses are repetitive. This is a destructive test. It is normally applicable to cavity-type packages. In general, this mechanical shock test is in conformity with IEC 60068-2-27 but, due to specific requirements of semiconductors, the clauses of this standard apply.
IEC 60749-10:2002 history
- 2022 IEC 60749-10:2022 Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock - device and subassembly
- 2003 IEC 60749-10:2002/COR1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock
- 2002 IEC 60749-10:2002 Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock
