IEC 60749-32:2002
Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)

Standard No.

IEC 60749-32:2002

Release Date

2002

Published By

International Electrotechnical Commission (IEC)

Status

Be replaced

Replace By

IEC 60749-32:2002/COR1:2003

Latest

IEC 60749-32:2002/AMD1:2010

Replace

IEC 47/1394/FDIS:1996 IEC 60749:1996 IEC 60749 AMD 1:2000 IEC 60749 AMD 2:2001 IEC 60749 Edition 2.2:2002

Scope

This part of IEC 60749 is applicable to semiconductor devices (discrete devices and integrated circuits). The object of this test is to determine whether the device ignites due to external heating. The test uses a needle flame, simulating the effect of small flames which may result from fault conditions within equipment containing the device. NOTE This test is identical to the test method contained in 1.2 of chapter 4 of IEC 60749 (1996), apart from the addition of this clause, the addition of titles to clauses 2 and 3 and renumbering.

IEC 60749-32:2002 history

• 2010 IEC 60749-32:2002/AMD1:2010 Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
• 2010 IEC 60749-32:2010 Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
• 2003 IEC 60749-32:2002/COR1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
• 2002 IEC 60749-32:2002 Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)