JEDEC JESD51-31-2008
Thermal Test Environment Modifications for MultiChip Packages
- Standard No.
- JEDEC JESD51-31-2008
- Release Date
- 2008
- Published By
- (U.S.) Joint Electron Device Engineering Council Soild State Technology Association
- Scope
- This document specifies the appropriate modifications needed for Multi-Chip Packages to the thermal test environmental conditions specified in the JESD51 series of specifications. The data obtained from methods of this document are the raw data used to document the thermal performance of the package. The use of this data will be documented in JESD51-XX, “Guideline to Support Effective Use of MCP Thermal Measurements” which is being prepared.
JEDEC JESD51-31-2008 Referenced Document
- JEDEC JESD51 Test Boards for Area Array Surface Mount Package Thermal Measurements
- JEDEC JESD51-1 Integrated Circuit Thermal Measurement Method - Electrical Test Method (Single Semiconductor Device)
- JEDEC JESD51-2 Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)
- JEDEC JESD51-3 Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
- JEDEC JESD51-4 Thermal Test Chip Guideline (Wire Bond Type Chip) Errata - September 1997; Replaces JEP129: 1997
- JEDEC JESD51-5 Extension of Thermal Test Board Standards for Packages with Direct Thermal Attachment Mechanisms
- JEDEC JESD51-6 Integrated Circuit Thermal Test Method Environmental Conditions - Forced Convection (Moving Air)
