JEDEC JESD51-3-1996
Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

Standard No.

JEDEC JESD51-3-1996

Release Date

1996

Published By

(U.S.) Joint Electron Device Engineering Council Soild State Technology Association

Scope

This specification covers leaded surface mount components of lead pitch greater than 0.35 mm up to a body size of 48 mm. It is not intended for through-hole, ball grid array, or socketed components. See the appropriate test specifications for these package types.