JEDEC JESD51-6-1999
Integrated Circuit Thermal Test Method Environmental Conditions - Forced Convection (Moving Air)

Standard No.
JEDEC JESD51-6-1999
Release Date
1999
Published By
(U.S.) Joint Electron Device Engineering Council Soild State Technology Association
Scope
This standard specifies the environmental conditions for determining thermal performance of an integrated circuit device in a forced convection environment when mounted on a standard test board. The thermal resistance measured using this document is RQJMA or BJMA. This methodology is not meant to and will not predict the performance of a device in an application-specific environment.
Integrated Circuit Thermal Test Method Environmental Conditions - Forced Convection (Moving Air)



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