JEDEC JESD51-9-2000
Test Boards for Area Array Surface Mount Package Thermal Measurements

Standard No.

JEDEC JESD51-9-2000

Release Date

2000

Published By

(U.S.) Joint Electron Device Engineering Council Soild State Technology Association

Scope

This specification is meant to be broad enough to incorporate a wide variety of surface mount area array package (e.g., BGA) design features and technologies. However, due to a limited number of signal layers that results in shorting some device pins in this specification, the boards described here may not be adequate for measurement of active devices as compared to applications with thermal test chips.