JEDEC JESD51-1-1995
Integrated Circuit Thermal Measurement Method - Electrical Test Method (Single Semiconductor Device)

Standard No.

JEDEC JESD51-1-1995

Release Date

1995

Published By

(U.S.) Joint Electron Device Engineering Council Soild State Technology Association

Scope

The measurement method described herein is equally applicable to both thermal test die and active intemted circuit devices. Thermal test die, consisting of a heat source and temperature sensor integrated into a semiconductor chip, are commonly used for package thermal characterization efforts, especially when one package is being compared to another. Integrated circuit devices, operating in an active mode that approximates intended applications, are used when specific application-oriented specification information is required.