JEDEC JESD51-5-1999
Extension of Thermal Test Board Standards for Packages with Direct Thermal Attachment Mechanisms

Standard No.

JEDEC JESD51-5-1999

Release Date

1999

Published By

(U.S.) Joint Electron Device Engineering Council Soild State Technology Association

Scope

This specification provides for additional design geometries to be added to established thermal test board standards. The additions are only to allow testing of packages that need direct thermal contact with the thermal test board. Boards designed with this specification are not to be used on packages that do not require direct thermal attachment to the test board. Following the intent of the previous test board specifications, this specification allows design of both universal test boards for a wide number of package geometries within a package family or for the design of unique boards for single packages.

JEDEC JESD51-5-1999 Referenced Document

• JEDEC JESD51 Test Boards for Area Array Surface Mount Package Thermal Measurements*， 2000-07-01 Update
• JEDEC JESD51-1 Integrated Circuit Thermal Measurement Method - Electrical Test Method (Single Semiconductor Device)
• JEDEC JESD51-2 Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)
• JEDEC JESD51-3 Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JEDEC JESD51-7 High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages