JEDEC JESD51-4-1997
Thermal Test Chip Guideline (Wire Bond Type Chip) Errata - September 1997; Replaces JEP129: 1997

Standard No.

JEDEC JESD51-4-1997

Release Date

1997

Published By

(U.S.) Joint Electron Device Engineering Council Soild State Technology Association

Status

Withdraw

Replace By

JEP126-1997

Scope

(From JEDEC Council Ballot JCB-96-25 formulated undere the cognizance of JC- 15.1 Committee on Thermal Characterization).