GB/T 17473.7-2008
Test method of precious metals pastes used for microelectronics.Determination of solderability and solderelaching resistance (English Version)

Standard No.: GB/T 17473.7-2008
Language: Chinese, Available in English version
Release Date: 2008
Published By: General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China
Status: Be replaced 2022-10
Replace By: GB/T 17473.7-2022
Latest: GB/T 17473.7-2022
Replace: GB/T 17473.7-1998

Scope: This part specifies the solderability and solder resistance determination methods of precious metal solderable pastes for microelectronics technology. This part is applicable to the determination of solderability and solder resistance of precious metal solderable pastes for microelectronics technology.

GB/T 17473.7-2008 history

2022 GB/T 17473.7-2022 Test methods of precious metals pastes used for microelectronics—Part 7: Determination of solderability and solder leaching resistance
2008 GB/T 17473.7-2008 Test method of precious metals pastes used for microelectronics.Determination of solderability and solderelaching resistance
1998 GB/T 17473.7-1998 Test methods of precious metal pastes used for thick-film microelectronics--Test of solderability and solderleaching resistance