GB/T 17473.7-1998
Test methods of precious metal pastes used for thick-film microelectronics--Test of solderability and solderleaching resistance (English Version)

Standard No.: GB/T 17473.7-1998
Language: Chinese, Available in English version
Release Date: 1998
Published By: General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China
Status: Be replaced 2008-09
Replace By: GB/T 17473.7-2008
Latest: GB/T 17473.7-2022

Scope: This standard specifies the test methods for solderability and solder resistance of precious metal solderable pastes. This standard applies to the solderability and solderability tests of precious metal solderable pastes. Non-precious metal tin paste can also be used as a reference.

GB/T 17473.7-1998 history

2022 GB/T 17473.7-2022 Test methods of precious metals pastes used for microelectronics—Part 7: Determination of solderability and solder leaching resistance
2008 GB/T 17473.7-2008 Test method of precious metals pastes used for microelectronics.Determination of solderability and solderelaching resistance
1998 GB/T 17473.7-1998 Test methods of precious metal pastes used for thick-film microelectronics--Test of solderability and solderleaching resistance