This part specifies the test method for the adhesion of precious metal pastes for microelectronics. This section applies to the determination of the adhesion of precious metal pastes used in microelectronics.
GB/T 17473.4-2008 Referenced Document
GB/T 8170 Rules of rounding off for numerical values & expression and judgement of limiting values*, 2008-07-16 Update
GB/T 17473.4-2008 history
2008GB/T 17473.4-2008 Test methods of precious metals pastes used for microelectronics.Determination of adhesion
1998GB/T 17473.4-1998 Test methods of precious metal pastes used for thick film microelectronics--Determination of adhesion