GB/T 17473.7-2022
Test methods of precious metals pastes used for microelectronics—Part 7: Determination of solderability and solder leaching resistance (English Version)

Standard No.

GB/T 17473.7-2022

Language

Chinese, Available in English version

Release Date

2022

Published By

国家市场监督管理总局、中国国家标准化管理委员会

Latest

GB/T 17473.7-2022

Replace

GB/T 17473.7-2008

Scope

This document specifies the solderability and solder resistance test methods for precious metal pastes used in microelectronics technology. This document is applicable to the determination of solderability and solder resistance of precious metal pastes used in microelectronics technology. Non-precious metal paste solderable paste can also be used as a reference.

GB/T 17473.7-2022 Referenced Document

• GB/T 20422 Lead-free solders
• GB/T 3131 Tin-lead solder

GB/T 17473.7-2022 history

• 2022 GB/T 17473.7-2022 Test methods of precious metals pastes used for microelectronics—Part 7: Determination of solderability and solder leaching resistance
• 2008 GB/T 17473.7-2008 Test method of precious metals pastes used for microelectronics.Determination of solderability and solderelaching resistance
• 1998 GB/T 17473.7-1998 Test methods of precious metal pastes used for thick-film microelectronics--Test of solderability and solderleaching resistance

GB/T 17473.7-2022 -All Parts