General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China
Latest
GB/T 36356-2018
Scope
This standard specifies the technical requirements, inspection methods, inspection rules, packaging, transportation and storage of power semiconductor light-emitting diode chip products (hereinafter referred to as chips). This standard applies to power semiconductor light-emitting diode chips.
GB/T 36356-2018 Referenced Document
GB/T 2423.15-2008 Environmental testing for electric and electronic products.Part 2:Tests methods.Test Ga and guidance:Acceleration,steady
GB/T 2423.22-2012 Environmental testing.Part 2:Test methods.Test N:Change of temperature
GB/T 2423.4-2008 Environmental testing for electrical and electronic products - Part 2: Test method Test Db alternating damp heat (12h + 12h cycle)
GB/T 4589.1-2006 Semiconductor devices. Part 10: Generic specification for discrete devices and integrated circuits
GB/T 4937.1-2006 Semiconductor devices. Mechanical and climatic test methods. Part 1: General
IEC 60749 Semiconductor devices - Mechanical and climatic test methods
IEC 60749-19:2010 Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength test
IEC 60749-22:2002 Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength
SJ/T 11394-2009 Measure methods of semiconductor light emitting diodes
SJ/T 11399-2009 Measurement methods for chips of light emitting diodes
GB/T 36356-2018 history
2018GB/T 36356-2018 Technical specification for power light-emitting diode chips