GB/T 4937.1-2006
Semiconductor devices. Mechanical and climatic test methods. Part 1: General (English Version)

Standard No.
GB/T 4937.1-2006
Language
Chinese, Available in English version
Release Date
2006
Published By
General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China
Latest
GB/T 4937.1-2006
Replace
GB/T 4937-1995
Scope
This Part applies to semiconductor devices (discrete devices and integrated circuits) and establishes general guidelines for other parts of the GB/T 4937 series. When there is a contradiction between this part and the corresponding detailed specification, the detailed specification shall prevail.

GB/T 4937.1-2006 Referenced Document

  • IEC 60050 International Electrotechnical Vocabulary (IEV) - Index
  • IEC 60747 Semiconductor devices - Part 9: Discrete devices - Insulated-gate bipolar transistors (IGBTs)*， 2019-11-13 Update
  • IEC 60748 Semiconductor devices - Integrated circuits - Part 5: Semicustom integrated circuits

GB/T 4937.1-2006 history

  • 2006 GB/T 4937.1-2006 Semiconductor devices. Mechanical and climatic test methods. Part 1: General
  • 1995 GB/T 4937-1995 Mechanical and climatic test methods for semiconductor devices
Semiconductor devices. Mechanical and climatic test methods. Part 1: General

GB/T 4937.1-2006 -All Parts

GB/T 4937.1-2006 Semiconductor devices. Mechanical and climatic test methods. Part 1: General GB/T 4937.11-2018 Semiconductor devices—Mechanical and climatic test methods—Part 11: Rapid change of temperature—Two-fluid-bath method GB/T 4937.12-2018 Semiconductor devices—Mechanical and climatic test methods—Part 12: Vibration, variable frequency GB/T 4937.13-2018 Semiconductor devices—Mechanical and climatic test methods—Part 13: Salt atmosphere GB/T 4937.14-2018 Semiconductor devices—Mechanical and climatic test methods—Part 14: Robustness of terminations（lead integrity） GB/T 4937.15-2018 Semiconductor devices—Mechanical and climatic test methods—Part 15: Resistance to soldering temperature for through-hole mounted devices GB/T 4937.17-2018 Semiconductor devices—Mechanical and climatic test methods—Part 17: Neutron irradiation GB/T 4937.18-2018 Semiconductor devices—Mechanical and climatic test methods—Part 18: Ionizing radiation (total dose) GB/T 4937.19-2018 Semiconductor devices—Mechanical and climatic test methods—Part 19: Die shear strength GB/T 4937.2-2006 Semiconductor devices. Mechanical and climatic test methods. Part 2: Low air pressure GB/T 4937.20-2018 Semiconductor devices—Mechanical and climatic test methods—Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat GB/T 4937.201-2018 Semiconductor devices—Mechanical and climatic test methods—Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat GB/T 4937.21-2018 Semiconductor devices—Mechanical and climatic test methods—Part 21: Solderability GB/T 4937.22-2018 Semiconductor devices—Mechanical and climatic test methods—Part 22: Bond strength GB/T 4937.23-2023 Semiconductor devices—Mechanical and climatic test methods—Part 23:High temperature operating life GB/T 4937.26-2023 Mechanical and Climatic Test Methods for Semiconductor Devices Part 26: Electrostatic Discharge (ESD) Susceptibility Test Human Body Model (HBM) GB/T 4937.27-2023 Mechanical and Climatic Test Methods for Semiconductor Devices Part 27: Electrostatic Discharge (ESD) Susceptibility Test Machine Model (MM) GB/T 4937.3-2012 Semiconductor devices.Mechanical and climatic tests methods.Part 3:External visual examination GB/T 4937.30-2018 Semiconductor devices—Mechanical and climatic test methods—Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing GB/T 4937.31-2023 Semiconductor Devices Mechanical and Climatic Test Methods Part 31: Flammability of Plastic Encapsulated Devices (Internally Induced) GB/T 4937.32-2023 Mechanical and climatic test methods for semiconductor devices Part 32: Flammability of plastic encapsulated devices (externally induced) GB/T 4937.34-2024 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling GB/T 4937.35-2024 Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopic examination of plastically encapsulated electronic components GB/T 4937.4-2012v Semiconductor Device Mechanical and Climatic Test Methods Part 4: Highly Accelerated Steady State Damp Heat Test (HAST) GB/T 4937.42-2023 Semiconductor devices—Mechanical and climatic test methods—Part 42:Temperature and humidity storage


Copyright ©2024 All Rights Reserved