KS C IEC 60749:2004
Semiconductor devices－Mechanical and climate test methods

Standard No.

KS C IEC 60749:2004

Release Date

2004

Published By

Korean Agency for Technology and Standards (KATS)

Status

Be replaced 2005-12

Replace By

KS C IEC 60749-21:2005

Latest

KS C IEC 60749-34-2022

Scope

This standard lists methods that can be used for each individual semiconductor device and integrated circuit. that

KS C IEC 60749:2004 history

• 2022 KS C IEC 60749-34-2022 Semiconductor devices－Mechanical and climatic test methods－Part 34：Power cycling
• 2021 KS C IEC 60749-8-2021 Semiconductor devices－Mechanical and climatic test methods－Part 8：Sealing
• 2020 KS C IEC 60749-9:2020 Semiconductor devices — Mechanical and climatic test methods — Part 9: Permanence of marking
• 2019 KS C IEC 60749-3:2019 Semiconductor devices — Mechanical and climatic test methods — Part 3: External visual examination
• 2017 KS C IEC 60749-34:2017 Semiconductor devices－Mechanical and climatic test methods－Part 34：Power cycling
• 0000 KS C IEC 60749-8-2006(2016)
• 2006 KS C IEC 60749-8:2006 Semiconductor devices－Mechanical and climatic test methods－Part 8：Sealing
• 2005 KS C IEC 60749-21:2005 Semiconductor devices－Mechanical and climatic test methods－ Part 21：Solderability
• 2004 KS C IEC 60749:2004 Semiconductor devices－Mechanical and climate test methods
• 2003 KS C IEC 60749-9:2003 Semiconductor devices-Mechanical and climatic test methods-Part 9:Permanence of marking
• 2002 KS C IEC 60749-3:2002 Discrete semiconductor devices－Mechanical and climatic test methods－Part 3：External visual examination