KS C IEC 60749-9:2003
Semiconductor devices-Mechanical and climatic test methods-Part 9:Permanence of marking

Standard No.

KS C IEC 60749-9:2003

Release Date

2003

Published By

Korean Agency for Technology and Standards (KATS)

Status

Withdraw

Replace By

KS C IEC 60749-9:2020

Latest

KS C IEC 60749-9:2020

Scope

The purpose of this standard is to remove soldering flux residue from the printed circuit board assembly process.

KS C IEC 60749-9:2003 history

• 2020 KS C IEC 60749-9:2020 Semiconductor devices — Mechanical and climatic test methods — Part 9: Permanence of marking
• 2003 KS C IEC 60749-9:2003 Semiconductor devices-Mechanical and climatic test methods-Part 9:Permanence of marking