KS C IEC 60749-21:2005
Semiconductor devices－Mechanical and climatic test methods－ Part 21：Solderability

Standard No.

KS C IEC 60749-21:2005

Release Date

2005

Published By

Korean Agency for Technology and Standards (KATS)

Status

Be replaced

Replace By

KS C IEC 60749-21:2020

Latest

KS C IEC 60749-21:2020

Scope

This standard uses tin-lead (SnPb) or lead-free (Pb-free) solder for attachment.

KS C IEC 60749-21:2005 history

• 2020 KS C IEC 60749-21:2020 Semiconductor devices — Mechanical and climatic test methods — Part 21: Solderability
• 2005 KS C IEC 60749-21:2005 Semiconductor devices－Mechanical and climatic test methods－ Part 21：Solderability