GB/T 17473.4-1998
Test methods of precious metal pastes used for thick film microelectronics--Determination of adhesion (English Version)
- Standard No.
- GB/T 17473.4-1998
- Language
- Chinese, Available in English version
- Release Date
- 1998
- Published By
- General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China
- Status
- 2008-09
- Replace By
- GB/T 17473.4-2008
- Latest
- GB/T 17473.4-2008
- Scope
- This standard specifies the test method for the adhesion of precious metal pastes. This standard is applicable to the determination of the adhesion of precious metal conductor paste, and non-precious metal paste can also be used as a reference.
GB/T 17473.4-1998 history
- 2008 GB/T 17473.4-2008 Test methods of precious metals pastes used for microelectronics.Determination of adhesion
- 1998 GB/T 17473.4-1998 Test methods of precious metal pastes used for thick film microelectronics--Determination of adhesion
GB/T 17473.4-1998 -All Parts
GB/T 17473.1-2008 Test method of precious metals pastes used for microelectronics.Determination of solids content
GB/T 17473.2-2008 Test method of precious metals pastes used for microelectronics.Determination of fineness
GB/T 17473.3-2008 Test method of precious metals pastes used for microelectronics.Determination of sheet resistance
GB/T 17473.4-2008 Test methods of precious metals pastes used for microelectronics.Determination of adhesion
GB/T 17473.5-2008 Test method of precious metals pastes used for microelectronics.Determination of viscosity
GB/T 17473.6-2008 Test method of precious metals pastes used for microelectronics.Determination of resolution
GB/T 17473.7-2022 Test methods of precious metals pastes used for microelectronics—Part 7: Determination of solderability and solder leaching resistance