IEC 60749/AMD2:2001 Semiconductor devices - Mechanical and climatic test methods; Amendment 2 was changed to IEC 60749-6:2002 Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature.
IEC 60749/AMD2:2001 Semiconductor devices - Mechanical and climatic test methods; Amendment 2 was changed to IEC 60749-9:2002 Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking.
IEC 60749/AMD2:2001 Semiconductor devices - Mechanical and climatic test methods; Amendment 2 was changed to IEC 60749-11:2002 Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature; Two-fluid-bath method.
IEC 60749/AMD2:2001 Semiconductor devices - Mechanical and climatic test methods; Amendment 2 was changed to IEC 60749-13:2002 Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere.
IEC 60749/AMD2:2001 Semiconductor devices - Mechanical and climatic test methods; Amendment 2 was changed to IEC 60749-12:2002 Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency.
IEC 60749/AMD2:2001 Semiconductor devices - Mechanical and climatic test methods; Amendment 2 was changed to IEC 60749-1:2002 Semiconductor devices - Mechanical and climatic test methods - Part 1: General.
IEC 60749/AMD2:2001 Semiconductor devices - Mechanical and climatic test methods; Amendment 2 was changed to IEC 60749-8:2002 Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing.
IEC 60749/AMD2:2001 Semiconductor devices - Mechanical and climatic test methods; Amendment 2 was changed to IEC 60749-31:2002 Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced).
IEC 60749/AMD2:2001 Semiconductor devices - Mechanical and climatic test methods; Amendment 2 was changed to IEC 60749-32:2002 Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced).
IEC 60749/AMD2:2001 Semiconductor devices - Mechanical and climatic test methods; Amendment 2 was changed to IEC 60749-22:2002 Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength.
IEC 60749/AMD2:2001 Semiconductor devices - Mechanical and climatic test methods; Amendment 2 was changed to IEC 60749-3:2002 Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination.
IEC 60749/AMD2:2001 Semiconductor devices - Mechanical and climatic test methods; Amendment 2 was changed to IEC 60749-7:2002 Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases.
IEC 60749/AMD2:2001 Semiconductor devices - Mechanical and climatic test methods; Amendment 2 was changed to IEC 60749-10:2002 Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock.
IEC 60749/AMD2:2001 Semiconductor devices - Mechanical and climatic test methods; Amendment 2 was changed to IEC 60749-4:2002 Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST).
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