IEC 60749/AMD1:2000
Semiconductor devices - Mechanical and climatic test methods; Amendment 1

Standard No.

IEC 60749/AMD1:2000

Release Date

2000

Published By

International Electrotechnical Commission (IEC)

Status

Withdraw 2002-04

Replace By

IEC 60749/AMD2:2001

Latest

IEC 60749:2002

Replace

IEC 47/1477/FDIS:2000

IEC 60749/AMD1:2000 history

• 2002 IEC 60749:2002 Semiconductor devices - Mechanical and climatic test methods
• 2001 IEC 60749/AMD2:2001 Semiconductor devices - Mechanical and climatic test methods; Amendment 2
• 2000 IEC 60749/AMD1:2000 Semiconductor devices - Mechanical and climatic test methods; Amendment 1
• 1996 IEC 60749:1996 Semiconductor devices - Mechanical and climatic test methods
• 1993 IEC 60749/AMD2:1993 Semiconductor devices; mechanical and climatic test methods; amendment 2
• 1991 IEC 60749/AMD1:1991 Semiconductor devices; mechanical and climatic test methods; amendment 1
• 1984 IEC 60749:1984 Semiconductor devices. Mechanical and climatic test methods

IEC 60749/AMD1:2000 Semiconductor devices - Mechanical and climatic test methods; Amendment 1 was changed to IEC 60749-6:2002 Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature.

IEC 60749/AMD1:2000 Semiconductor devices - Mechanical and climatic test methods; Amendment 1 was changed to IEC 60749-9:2002 Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking.

IEC 60749/AMD1:2000 Semiconductor devices - Mechanical and climatic test methods; Amendment 1 was changed to IEC 60749-11:2002 Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature; Two-fluid-bath method.

IEC 60749/AMD1:2000 Semiconductor devices - Mechanical and climatic test methods; Amendment 1 was changed to IEC 60749-13:2002 Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere.

IEC 60749/AMD1:2000 Semiconductor devices - Mechanical and climatic test methods; Amendment 1 was changed to IEC 60749-12:2002 Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency.

IEC 60749/AMD1:2000 Semiconductor devices - Mechanical and climatic test methods; Amendment 1 was changed to IEC 60749-1:2002 Semiconductor devices - Mechanical and climatic test methods - Part 1: General.

IEC 60749/AMD1:2000 Semiconductor devices - Mechanical and climatic test methods; Amendment 1 was changed to IEC 60749-8:2002 Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing.

IEC 60749/AMD1:2000 Semiconductor devices - Mechanical and climatic test methods; Amendment 1 was changed to IEC 60749-31:2002 Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced).

IEC 60749/AMD1:2000 Semiconductor devices - Mechanical and climatic test methods; Amendment 1 was changed to IEC 60749-32:2002 Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced).

IEC 60749/AMD1:2000 Semiconductor devices - Mechanical and climatic test methods; Amendment 1 was changed to IEC 60749-22:2002 Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength.

IEC 60749/AMD1:2000 Semiconductor devices - Mechanical and climatic test methods; Amendment 1 was changed to IEC 60749-7:2002 Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases.

IEC 60749/AMD1:2000 Semiconductor devices - Mechanical and climatic test methods; Amendment 1 was changed to IEC 60749-10:2002 Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock.

IEC 60749/AMD1:2000 Semiconductor devices - Mechanical and climatic test methods; Amendment 1 was changed to IEC 60749-4:2002 Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST).

IEC 60749/AMD1:2000 Semiconductor devices - Mechanical and climatic test methods; Amendment 1 was changed to IEC 60749-20:2002 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat.

IEC 60749/AMD1:2000 Semiconductor devices - Mechanical and climatic test methods; Amendment 1 was changed to IEC 60749:2002 Semiconductor devices - Mechanical and climatic test methods.