ISO 9453:1990
Soft solder alloys; chemical compositions and forms

Standard No.
ISO 9453:1990
Release Date
1990
Published By
International Organization for Standardization (ISO)
Status
Replace By
ISO 9453:2006
Latest
ISO 9453:2020
Scope
Specifies the requirements for chemical composition for the following soft solder alloys: tin-lead, with and without antimony; tin-silver, with and without lead; tin-copper, with and without lead; tin-antimony; tin-lead-bismuth; bismuth-tin; tin-lead-cadmium; tin-indium; lead-silver, with and without tin.

ISO 9453:1990 history

  • 2020 ISO 9453:2020 Soft solder alloys — Chemical compositions and forms
  • 2014 ISO 9453:2014 Soft solder alloys - Chemical compositions and forms
  • 2006 ISO 9453:2006 Soft solder alloys - Chemical compositions and forms
  • 1990 ISO 9453:1990 Soft solder alloys; chemical compositions and forms



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