Specifies the requirements for chemical composition for the following soft solder alloys: tin-lead, with and without antimony; tin-silver, with and without lead; tin-copper, with and without lead; tin-antimony; tin-lead-bismuth; bismuth-tin; tin-lead-cadmium; tin-indium; lead-silver, with and without tin.
ISO 9453:1990 history
2020ISO 9453:2020 Soft solder alloys — Chemical compositions and forms
2014ISO 9453:2014 Soft solder alloys - Chemical compositions and forms
2006ISO 9453:2006 Soft solder alloys - Chemical compositions and forms
1990ISO 9453:1990 Soft solder alloys; chemical compositions and forms