ISO 9453:2006
Soft solder alloys - Chemical compositions and forms
- Standard No.
- ISO 9453:2006
- Release Date
- 2006
- Published By
- International Organization for Standardization (ISO)
- Status
- Replace By
- ISO 9453:2014
- Latest
- ISO 9453:2020
- Scope
- This International Standard specifies the requirements for chemical composition for the following families of soft solder alloys: — tin-lead, with and without antimony, bismuth, cadmium, copper, and silver; — tin-antimony; — tin-bismuth; — tin-copper, with and without silver; — tin-indium, with and without silver and bismuth; — tin-silver, with and without copper and bismuth; — tin-zinc, with and without bismuth. It also includes an indication of the forms generally available.
ISO 9453:2006 Referenced Document
- ISO 3677 Filler metal for brazing - Designation*， 2024-03-18 Update
ISO 9453:2006 history
- 2020 ISO 9453:2020 Soft solder alloys — Chemical compositions and forms
- 2014 ISO 9453:2014 Soft solder alloys - Chemical compositions and forms
- 2006 ISO 9453:2006 Soft solder alloys - Chemical compositions and forms
- 1990 ISO 9453:1990 Soft solder alloys; chemical compositions and forms
