ISO 9453:2014
Soft solder alloys - Chemical compositions and forms

Standard No.

ISO 9453:2014

Release Date

2014

Published By

International Organization for Standardization (ISO)

Status

Be replaced

Replace By

ISO 9453:2020

Latest

ISO 9453:2020

Scope

WARNING — National or regional regulations may limit the employment of certain alloys. This International Standard specifies the requirements for chemical composition for soft solder alloys containing two or more of tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium. An indication of the forms generally available is also included.

ISO 9453:2014 Referenced Document

• IEC 61190-1-3:2007 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
• ISO 3677:1992 Filler metal for soft soldering, brazing and braze welding; designation

ISO 9453:2014 history

• 2020 ISO 9453:2020 Soft solder alloys — Chemical compositions and forms
• 2014 ISO 9453:2014 Soft solder alloys - Chemical compositions and forms
• 2006 ISO 9453:2006 Soft solder alloys - Chemical compositions and forms
• 1990 ISO 9453:1990 Soft solder alloys; chemical compositions and forms