ISO 9453:2020
Soft solder alloys — Chemical compositions and forms

Standard No.

ISO 9453:2020

Release Date

2020

Published By

International Organization for Standardization (ISO)

Latest

ISO 9453:2020

Scope

This document specifies the requirements for chemical composition for soft solder alloys containing two or more of: tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium. An indication of the forms generally available is also included.

ISO 9453:2020 history

• 2020 ISO 9453:2020 Soft solder alloys — Chemical compositions and forms
• 2014 ISO 9453:2014 Soft solder alloys - Chemical compositions and forms
• 2006 ISO 9453:2006 Soft solder alloys - Chemical compositions and forms
• 1990 ISO 9453:1990 Soft solder alloys; chemical compositions and forms