IEC 60749-4:2017
Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
- Standard No.
- IEC 60749-4:2017
- Release Date
- 2017
- Published By
- International Electrotechnical Commission (IEC)
- Latest
- IEC 60749-4:2017
- Replace
- IEC 47/2346/FDIS:2016 IEC 60749-4:2002 IEC 60749-4 CORR 1:2003
- Scope
- This part of IEC 60749 provides a highly accelerated temperature and humidity stress test (HAST) for the purpose of evaluating the reliability of non-hermetic packaged semiconductor devices in humid environments.
IEC 60749-4:2017 Referenced Document
- IEC 60749-5:2003 Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test
IEC 60749-4:2017 history
- 2017 IEC 60749-4:2017 Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
- 2003 IEC 60749-4:2002/COR1:2003 Semiconductor Devices - Mechanical and Climatic Test Methods - Part 4: Damp Heat@ Steady State@ Highly Accelerated Stress Test (HAST) CORRIGENDUM 1 (Edition 1.0)
- 2002 IEC 60749-4:2002 Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
