GB/T 6617-2009
Test method for measuring resistivity of silicon wafer using spreading resistance probe (English Version)

Standard No.
GB/T 6617-2009
Language
Chinese, Available in English version
Release Date
2009
Published By
General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China
Latest
GB/T 6617-2009
Replace
GB/T 6617-1995
Scope
This standard specifies the method for measuring the resistivity of silicon wafers with spreading resistance probes. This standard is suitable for measuring the resistivity of silicon wafers with known crystal orientation and conductivity type and measuring the resistivity of the epitaxial layer of silicon wafers with the same type or inverse type of substrate. Measuring range: 10-3Ω·cm~ 102 Ω·cm.

GB/T 6617-2009 Referenced Document

  • GB/T 14847 Test method for thickness of lightly doped silicon epitaxial layers on heavily doped silicon substrates by infrared reflectance*2011-01-10 Update
  • GB/T 1550 Test methods for conductivity type of extrinsic semiconducting materials*2018-12-28 Update
  • GB/T 1552 Test method for measuring resistivity of monocrystal silicon and germanium with a collinear four-probe array
  • GB/T 1555 Method for Determination of Crystalline Orientation of Semiconductor Single Crystal*2023-08-06 Update

GB/T 6617-2009 history

  • 2009 GB/T 6617-2009 Test method for measuring resistivity of silicon wafer using spreading resistance probe
  • 1995 GB/T 6617-1995 Test method for measuring resistivity of silicon wafers using spreading resistance probe
Test method for measuring resistivity of silicon wafer using spreading resistance probe



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