GB/T 14847-2010
Test method for thickness of lightly doped silicon epitaxial layers on heavily doped silicon substrates by infrared reflectance (English Version)

Standard No.
GB/T 14847-2010
Language
Chinese, Available in English version
Release Date
2011
Published By
General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China
Latest
GB/T 14847-2010
Replace
GB/T 14847-1993
Scope
This standard specifies the infrared reflectance measurement method for the thickness of the lightly doped silicon epitaxial layer on the heavily doped substrate. This standard applies to the measurement of the thickness of n-type and p-type silicon epitaxial layers whose resistivity of the substrate is less than 0.02Ω·cm at 23°C and the resistivity of the epitaxial layer is greater than 0.1Ω·cm at 23°C and the thickness of the epitaxial layer is greater than 2μm; In terms of accuracy, this method is also suitable for testing the thickness of n-type and p-type epitaxial layers between 0.5 μm and 2 μm in principle.

GB/T 14847-2010 Referenced Document

  • GB/T 14264 Semiconductor materials-Terms and definitions
  • GB/T 1552 Test method for measuring resistivity of monocrystal silicon and germanium with a collinear four-probe array
  • GB/T 6379.2 Accuracy(trueness and precision)of measurement methods and results-Part 2:Basic method for the determination of repeatability and reproducibility of a standard measurement method

GB/T 14847-2010 history

  • 2011 GB/T 14847-2010 Test method for thickness of lightly doped silicon epitaxial layers on heavily doped silicon substrates by infrared reflectance
  • 1993 GB/T 14847-1993 Test method for thickness of lightly doped silicon eqitaxial layers on heavily doped silicon substrates by infrared reflectance
Test method for thickness of lightly doped silicon epitaxial layers on heavily doped silicon substrates by infrared reflectance



Copyright ©2024 All Rights Reserved