DIN EN 62137-1-1:2008 PDF

DIN EN 62137-1-1:2008 Referenced Document

IEC 60068-1 Environmental testing - Part 1: General and guidance*， 2013-10-01 Update
IEC 60194 Printed board design, manufacture and assembly - Terms and definitions*， 2015-04-01 Update
IEC 61188-5-5 Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides
IEC 61190-1-1 Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
IEC 61190-1-2 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering paste for high-quality interconnects in electronics assembly*， 2014-02-01 Update
IEC 61190-1-3 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications*， 2017-12-13 Update
IEC 61249-2-7 Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad; Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad

2008 DIN EN 62137-1-1:2008-02 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test (IEC 62137-1-1:2007); German version EN 62137-1-1:2007
2008 DIN EN 62137-1-1:2008 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test (IEC 62137-1-1:2007); German version EN 62137-1-1:2007