IEC 61190-1-2:2014
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering paste for high-quality interconnects in electronics assembly
- Standard No.
- IEC 61190-1-2:2014
- Release Date
- 2014
- Published By
- International Electrotechnical Commission (IEC)
- Latest
- IEC 61190-1-2:2014
- Replace
- IEC 91/1154A/FDIS:2013 IEC 61190-1-2:2007
IEC 61190-1-2:2014 Referenced Document
- IEC 60194:2006 Printed board design, manufacture and assembly - Terms and definitions
- IEC 61189-5-3 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies*， 2015-01-01 Update
- IEC 61190-1-1:2002 Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
- IEC 61190-1-3:2007 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
- ISO 9454-2:1998 Soft soldering fluxes - Classification and requirements - Part 2: Performance requirements
IEC 61190-1-2:2014 history
- 2014 IEC 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering paste for high-quality interconnects in electronics assembly
- 2007 IEC 61190-1-2:2007 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering paste for high-quality interconnects in electronics assembly
- 2002 IEC 61190-1-2:2002 Attachment materials for electronic assembly - Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assembly
