IEC 61190-1-1:2002
Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly

Standard No.

IEC 61190-1-1:2002

Release Date

2002

Published By

International Electrotechnical Commission (IEC)

Latest

IEC 61190-1-1:2002

Replace

IEC 91/277/FDIS:2001

Scope

This part of IEC 61190 specifies general requirements for the classification and testing of soldering fluxes for high-quality interconnections in electronics assembly. This standard is a flux characterization, quality control, and procurement document for solder flux and flux containing material in electronics assembly technology.

IEC 61190-1-1:2002 history

• 2002 IEC 61190-1-1:2002 Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly