- Standard No.
- IEC 61249-2-7:2002
- Release Date
- 2002
- Published By
- International Electrotechnical Commission (IEC)
- Latest
-
IEC 61249-2-7:2002
- Replace
-
IEC 91/276/FDIS:2001
IEC 60249-2-5:1987
IEC 60249-2-5 AMD 5:2000
IEC 60249-2-12:1987
IEC 60249-2-12 AMD 4:2000
- Scope
- This part of IEC 61249 gives requirements for properties of epoxide woven E-glass laminated sheet 0,05 mm up to 3,2 mm, of defined flammability (vertical burning test), copper-clad. The flammability rating is achieved through the use of brominated fire retardants contained as an integral part of the polymeric structure. The glass transition temperature is defined to be 120 ℃ minimum.
Some property requirements may have several classes of performance. The class desired must be specified on the purchase order otherwise the default class of material will be supplied.
IEC 61249-2-7:2002 history
- 2002 IEC 61249-2-7:2002 Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad; Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad
IEC 61249-2-7:2002 Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad; Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad has been changed from IEC 60249-2-5:1987 Base materials for printed circuits. Part 2: Specifications. Specification No. 5: Epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test).
IEC 61249-2-7:2002 Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad; Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad has been changed from IEC 60249-2-12:1987 Base Materials for Printed Circuits Part 2: Specifications Specification No. 12: Thin Epoxide Woven Glass Fabric Copper-Clad Laminated Sheet of Defined Flammability@ for Use in the Fabrication of Multilayer Printed Boards (Edition 2.0; Amendment 2- 05 199.