JEDEC JESD51-7-1999
High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

Standard No.

JEDEC JESD51-7-1999

Release Date

1999

Published By

(U.S.) Joint Electron Device Engineering Council Soild State Technology Association

Scope

This specification covers leaded surface mount components. It is not intended for through-hole, ball grid array, or socketed components. It does not cover packages with features (such as exposed die paddles) intended for direct thermal contact to multi-layer planes. See the appropriate test specifications for these package types.