IEC 62137-1-2:2007 PDF

Scope: This test method described in this part of IEC 62137 is applicable to leadless surface mounting components and surface mounting connectors to which put test is not applicable. It is not applicable to multi-lead components and gull-wing leads. The method is designed to test and evaluate the endurance of the solder joint between component terminates and lands on a substrate, by means of a shear type mechanical stress. This test is applicable to evaluate the effects of repeated temperature change on the strength of the solder joints between terminals and lands on a substrate.

IEC 62137-1-2:2007 Referenced Document

IEC 60068-1 Environmental testing - Part 1: General and guidance*， 2013-10-01 Update
IEC 60194 Printed board design, manufacture and assembly - Terms and definitions*， 2015-04-01 Update
IEC 61188-5-2 Cartes imprimées et cartes imprimées équipées Conception et utilisation Partie 5-2: Considérations sur les liaisons pistes-soudures Composants discrets (Edition 1.0; Replaces IEC 60321 Ed. 1.0: 1970 and IEC 60321-2 Ed. 1.0: 1987)
IEC 61188-5-5 Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides*， 2007-10-01 Update
IEC 61190-1-2 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering paste for high-quality interconnects in electronics assembly*， 2014-02-01 Update
IEC 61190-1-3 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications*， 2017-12-13 Update
IEC 61249-2-7 Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad; Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad
IEC 61760-1 Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)*， 2020-07-14 Update

2007 IEC 62137-1-2:2007 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test