IEC 61188-5-2:2003
Cartes imprimées et cartes imprimées équipées Conception et utilisation Partie 5-2: Considérations sur les liaisons pistes-soudures Composants discrets (Edition 1.0; Replaces IEC 60321 Ed. 1.0: 1970 and IEC 60321-2 Ed. 1.0: 1987)

Standard No.

IEC 61188-5-2:2003

Release Date

2003

Published By

IEC - International Electrotechnical Commission

Latest

IEC 61188-5-2:2003

Replace

IEC 91/382/FDIS:2003

Scope

This part of IEC 61188 provides information on land pattern geometries used for the surface attachment of discrete electronic components. The purpose of this standard is to provide the appropriate size@ shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder fillet@ and also allow for inspection@ testing and rework of resulting solder joints. Each clause contains a specific set of clearly presented criteria providing information on the component@ the component dimensions@ the solder joint design and the land pattern dimensions.

IEC 61188-5-2:2003 history

• 2003 IEC 61188-5-2:2003 Cartes imprimées et cartes imprimées équipées Conception et utilisation Partie 5-2: Considérations sur les liaisons pistes-soudures Composants discrets (Edition 1.0; Replaces IEC 60321 Ed. 1.0: 1970 and IEC 60321-2 Ed. 1.0: 1987)