GB/T 4937.3-2012
Semiconductor devices.Mechanical and climatic tests methods.Part 3:External visual examination (English Version)
- Standard No.
- GB/T 4937.3-2012
- Language
- Chinese, Available in English version
- Release Date
- 2012
- Published By
- General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China
- Latest
- GB/T 4937.3-2012
- Scope
- The purpose of this part of GB/T 4937 is to verify whether the material, design, structure, marking and workmanship quality of semiconductor devices meet the requirements of the applicable procurement documents. External visual inspection is a non-destructive test applicable to all package types. This test is used for qualification inspection, process monitoring, and batch acceptance.
GB/T 4937.3-2012 history
- 2012 GB/T 4937.3-2012 Semiconductor devices.Mechanical and climatic tests methods.Part 3:External visual examination
GB/T 4937.3-2012 -All Parts
GB/T 4937.1-2006 Semiconductor devices. Mechanical and climatic test methods. Part 1: General
GB/T 4937.11-2018 Semiconductor devices—Mechanical and climatic test methods—Part 11: Rapid change of temperature—Two-fluid-bath method
GB/T 4937.12-2018 Semiconductor devices—Mechanical and climatic test methods—Part 12: Vibration, variable frequency
GB/T 4937.13-2018 Semiconductor devices—Mechanical and climatic test methods—Part 13: Salt atmosphere
GB/T 4937.14-2018 Semiconductor devices—Mechanical and climatic test methods—Part 14: Robustness of terminations（lead integrity）
GB/T 4937.15-2018 Semiconductor devices—Mechanical and climatic test methods—Part 15: Resistance to soldering temperature for through-hole mounted devices
GB/T 4937.17-2018 Semiconductor devices—Mechanical and climatic test methods—Part 17: Neutron irradiation
GB/T 4937.18-2018 Semiconductor devices—Mechanical and climatic test methods—Part 18: Ionizing radiation (total dose)
GB/T 4937.19-2018 Semiconductor devices—Mechanical and climatic test methods—Part 19: Die shear strength
GB/T 4937.2-2006 Semiconductor devices. Mechanical and climatic test methods. Part 2: Low air pressure
GB/T 4937.20-2018 Semiconductor devices—Mechanical and climatic test methods—Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
GB/T 4937.201-2018 Semiconductor devices—Mechanical and climatic test methods—Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
GB/T 4937.21-2018 Semiconductor devices—Mechanical and climatic test methods—Part 21: Solderability
GB/T 4937.22-2018 Semiconductor devices—Mechanical and climatic test methods—Part 22: Bond strength
GB/T 4937.23-2023 Semiconductor devices—Mechanical and climatic test methods—Part 23:High temperature operating life
GB/T 4937.26-2023 Mechanical and Climatic Test Methods for Semiconductor Devices Part 26: Electrostatic Discharge (ESD) Susceptibility Test Human Body Model (HBM)
GB/T 4937.27-2023 Mechanical and Climatic Test Methods for Semiconductor Devices Part 27: Electrostatic Discharge (ESD) Susceptibility Test Machine Model (MM)
GB/T 4937.3-2012 Semiconductor devices.Mechanical and climatic tests methods.Part 3:External visual examination
GB/T 4937.30-2018 Semiconductor devices—Mechanical and climatic test methods—Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
GB/T 4937.31-2023 Semiconductor Devices Mechanical and Climatic Test Methods Part 31: Flammability of Plastic Encapsulated Devices (Internally Induced)
GB/T 4937.32-2023 Mechanical and climatic test methods for semiconductor devices Part 32: Flammability of plastic encapsulated devices (externally induced)
GB/T 4937.34-2024 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
GB/T 4937.35-2024 Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopic examination of plastically encapsulated electronic components
GB/T 4937.4-2012v Semiconductor Device Mechanical and Climatic Test Methods Part 4: Highly Accelerated Steady State Damp Heat Test (HAST)
GB/T 4937.42-2023 Semiconductor devices—Mechanical and climatic test methods—Part 42:Temperature and humidity storage