GB/T 4937.31-2023
Semiconductor Devices Mechanical and Climatic Test Methods Part 31: Flammability of Plastic Encapsulated Devices (Internally Induced) (English Version)

Standard No.
GB/T 4937.31-2023
Language
Chinese, Available in English version
Release Date
2023
Published By
General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China
Latest
GB/T 4937.31-2023
Introduction
Introduction to GB/T 4937.31-2023 Semiconductor Devices - Mechanical and Climatic Test Methods - Part 31: Flammability (Internally Generated) of Molded Devices GB/T 4937.31-2023 is a standard that focuses on the flammability of molded semiconductor devices caused internally. This standard provides guidelines and test methods to assess the flammability characteristics of these devices, ensuring their safety and reliability. Semiconductor devices are widely used in various electronic applications, and it is crucial to understand their behavior in extreme conditions, such as exposure to fire or high temperatures. Flammability is a critical aspect to consider, as it directly affects the safety of these devices and the surrounding environment. The standard GB/T 4937.31-2023 covers the testing methods for evaluating the flammability of molded semiconductor devices. It defines the test procedures, test equipment, and criteria for determining the flammability rating of these devices. The standard also provides guidance on sample preparation and test conditions to ensure accurate and consistent results. By following the guidelines provided in this standard, manufacturers and users of molded semiconductor devices can assess their flammability characteristics and take appropriate measures to enhance safety. This standard helps in identifying potential risks and minimizing the chances of fire accidents caused by these devices. In conclusion, GB/T 4937.31-2023 plays a crucial role in ensuring the safety and reliability of molded semiconductor devices by providing standardized test methods to assess their flammability characteristics. Compliance with this standard enables manufacturers and users to make informed decisions and take necessary precautions to prevent fire accidents.

GB/T 4937.31-2023 history

  • 2023 GB/T 4937.31-2023 Semiconductor Devices Mechanical and Climatic Test Methods Part 31: Flammability of Plastic Encapsulated Devices (Internally Induced)

GB/T 4937.31-2023 -All Parts

GB/T 4937.1-2006 Semiconductor devices. Mechanical and climatic test methods. Part 1: General GB/T 4937.11-2018 Semiconductor devices—Mechanical and climatic test methods—Part 11: Rapid change of temperature—Two-fluid-bath method GB/T 4937.12-2018 Semiconductor devices—Mechanical and climatic test methods—Part 12: Vibration, variable frequency GB/T 4937.13-2018 Semiconductor devices—Mechanical and climatic test methods—Part 13: Salt atmosphere GB/T 4937.14-2018 Semiconductor devices—Mechanical and climatic test methods—Part 14: Robustness of terminations（lead integrity） GB/T 4937.15-2018 Semiconductor devices—Mechanical and climatic test methods—Part 15: Resistance to soldering temperature for through-hole mounted devices GB/T 4937.17-2018 Semiconductor devices—Mechanical and climatic test methods—Part 17: Neutron irradiation GB/T 4937.18-2018 Semiconductor devices—Mechanical and climatic test methods—Part 18: Ionizing radiation (total dose) GB/T 4937.19-2018 Semiconductor devices—Mechanical and climatic test methods—Part 19: Die shear strength GB/T 4937.2-2006 Semiconductor devices. Mechanical and climatic test methods. Part 2: Low air pressure GB/T 4937.20-2018 Semiconductor devices—Mechanical and climatic test methods—Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat GB/T 4937.201-2018 Semiconductor devices—Mechanical and climatic test methods—Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat GB/T 4937.21-2018 Semiconductor devices—Mechanical and climatic test methods—Part 21: Solderability GB/T 4937.22-2018 Semiconductor devices—Mechanical and climatic test methods—Part 22: Bond strength GB/T 4937.23-2023 Semiconductor devices—Mechanical and climatic test methods—Part 23:High temperature operating life GB/T 4937.26-2023 Mechanical and Climatic Test Methods for Semiconductor Devices Part 26: Electrostatic Discharge (ESD) Susceptibility Test Human Body Model (HBM) GB/T 4937.27-2023 Mechanical and Climatic Test Methods for Semiconductor Devices Part 27: Electrostatic Discharge (ESD) Susceptibility Test Machine Model (MM) GB/T 4937.3-2012 Semiconductor devices.Mechanical and climatic tests methods.Part 3:External visual examination GB/T 4937.30-2018 Semiconductor devices—Mechanical and climatic test methods—Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing GB/T 4937.31-2023 Semiconductor Devices Mechanical and Climatic Test Methods Part 31: Flammability of Plastic Encapsulated Devices (Internally Induced) GB/T 4937.32-2023 Mechanical and climatic test methods for semiconductor devices Part 32: Flammability of plastic encapsulated devices (externally induced) GB/T 4937.4-2012v Semiconductor Device Mechanical and Climatic Test Methods Part 4: Highly Accelerated Steady State Damp Heat Test (HAST) GB/T 4937.42-2023 Semiconductor devices—Mechanical and climatic test methods—Part 42:Temperature and humidity storage


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