GB/T 32280-2022
Test method for warp and bow of silicon wafers—Automated non-contact scanning method (English Version)
- Standard No.
- GB/T 32280-2022
- Language
- Chinese, Available in English version
- Release Date
- 2022
- Published By
- 国家市场监督管理总局、中国国家标准化管理委员会
- Latest
- GB/T 32280-2022
- Replace
- GB/T 32280-2015
- Scope
- This document describes a method for testing the warpage and curvature of silicon wafers using two probes for automatic non-contact scanning of the wafer surface. This document applies to clean and dry silicon wafers with a diameter of not less than 50 mm and a thickness of not less than 100 μm, including silicon wafers that are cut, ground, etched, polished, epitaxy, etched, or with other surface states. It can also be used for gallium arsenide, Warpage and curvature testing of silicon carbide, sapphire and other semiconductor wafers.
GB/T 32280-2022 Referenced Document
- GB/T 14264 Semiconductor materials-Terms and definitions
- GB/T 16596 Specification for establishing a wafer coordinate system
- GB/T 6619 Test method for bow of silicon wafers
- GB/T 6620 Test method for measuring warp on silicon slices by noncontact scanning
GB/T 32280-2022 history
- 2022 GB/T 32280-2022 Test method for warp and bow of silicon wafers—Automated non-contact scanning method
- 2015 GB/T 32280-2015 Test method for warp of silicon wafers.Automated non-contact scanning method
