GB/T 32280-2015
Test method for warp of silicon wafers.Automated non-contact scanning method (English Version)
- Standard No.
- GB/T 32280-2015
- Language
- Chinese, Available in English version
- Release Date
- 2015
- Published By
- General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China
- Status
- 2022-10
- Replace By
- GB/T 32280-2022
- Latest
- GB/T 32280-2022
- Scope
- This standard specifies the non-destructive, automatic non-contact scanning test method for warpage of silicon wafers. This standard applies to the warpage test of clean and dry cut, ground, corroded, polished, etched, epitaxial or other surface state silicon wafers with a diameter not less than 50 mm and a thickness not less than 100 μm. The method can be used for monitoring the warpage of silicon wafers caused by thermal effects and (or) mechanical effects, and can also be used for warpage testing of other semiconductor wafers such as gallium arsenide and sapphire.
GB/T 32280-2015 Referenced Document
- GB 50073-2013 Code for design of clean room
- GB/T 14264 Semiconductor materials-Terms and definitions
- GB/T 29507 Test method for measuring flatness,thickness and total thickness variation on silicon wafers.Automated non-contact scanning
- GB/T 6620 Test method for measuring warp on silicon slices by noncontact scanning
GB/T 32280-2015 history
- 2022 GB/T 32280-2022 Test method for warp and bow of silicon wafers—Automated non-contact scanning method
- 2015 GB/T 32280-2015 Test method for warp of silicon wafers.Automated non-contact scanning method
