IEC 60749-5:2017
Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test

Standard No.

IEC 60749-5:2017

Release Date

2017

Published By

International Electrotechnical Commission (IEC)

Status

Be replaced

Replace By

IEC 60749-5:2023 RLV

Latest

IEC 60749-5:2023 RLV

Replace

IEC 47/2367/FDIS:2017 IEC 60749-5:2003

Scope

This part of IEC 60749 provides a steady-state temperature and humidity bias life test for the purpose of evaluating the reliability of non-hermetic packaged solid-state devices in humid environments. This test method is considered destructive.

IEC 60749-5:2017 Referenced Document

• IEC 60749-4:2017 Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)

IEC 60749-5:2017 history

• 0000 IEC 60749-5:2023 RLV
• 2017 IEC 60749-5:2017 Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test
• 2003 IEC 60749-5:2003 Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test