IEC 60749-15:2010 Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
This part of IEC 60749 describes a test used to determine whether encapsulated solid state
devices used for through-hole mounting can withstand the effects of the temperature to which
they are subjected during soldering of their leads by using wave soldering or a soldering iron.
In order to establish a standard test procedure for the most reproducible methods, the solder
dip method is used because of its more controllable conditions. This procedure determines
whether devices are capable of withstanding the soldering temperature encountered in printed
wiring board assembly operations, without degrading their electrical characteristics or internal
connections.
This test is destructive and may be used for qualification, lot acceptance and as a product
monitor.
This test is, in general, in conformity with IEC 60068-2-20 but, due to specific requirements of
semiconductors, the clauses of this standard apply.
IEC 60749-15:2010 history
0000 IEC 60749-15:2020 RLV
2010IEC 60749-15:2010 Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
2003IEC 60749-15:2003 Semiconductor devices Mechanical and climatic test methods Part 15: Resistance to soldering temperature for through-hole mounted devices (Edition 1.0; Replaces IEC/PAS 62174: 2000; Together with IEC 60749-14:2003@ IEC 60749-3:2002 And IEC 60749-31:200