IEC 60749-15:2003 PDF

Scope: This part of IEC 60749 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering or a soldering iron. In order to establish a standard test procedure for the most reproducible methods, the solder dip method is used because of its more controllable conditions. This procedure determines whether devices are capable of withstanding the soldering temperature encountered in printed wiring board manufacturing operations, without degrading their electrical characteristics or internal connections. This test is destructive and may be used for qualification, lot acceptance and as a product monitor. This test is, in general, in conformity with IEC 60068-2-20 but, due to specific requirements of semiconductors, the clauses of this standard apply.

IEC 60749-15:2003 history

0000 IEC 60749-15:2020 RLV
2010 IEC 60749-15:2010 Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
2003 IEC 60749-15:2003 Semiconductor devices Mechanical and climatic test methods Part 15: Resistance to soldering temperature for through-hole mounted devices (Edition 1.0; Replaces IEC/PAS 62174: 2000; Together with IEC 60749-14:2003@ IEC 60749-3:2002 And IEC 60749-31:200