EN 60191-6-2 Mechanical Standardization of Semiconductor Devices Part 6-2: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for 1,50 mm, 1,27 mm and 1,00 mm Pitch Ball and Column Terminal Packages
EN 60191-6-5 Mechanical Standardization of Semiconductor Devices Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine-Pitch Ball Grid Array (FBGA)*， 2023-12-21 Update
EN 60194 Printed board design, manufacture and assembly - Terms and definitions
EN 61190-1-3 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications (Incorporates Amendment A1: 2010)
EN 61249-2-7 Materials for Printed Boards and Other Interconnecting Structures Part 2-7: Reinforced Base Materials Clad and Unclad - Epoxide Woven E-Glass Laminated Sheet of Defined Flammability (Vertical Burning Test), Copper-Clad (Incorporating Corrigendum September
EN 61249-2-8 Materials for printed boards and other interconnecting structures Part 2-8: Reinforced base materials clad and unclad Modified brominated epoxide woven fibreglass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
EN 62137-3:2012 Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints
IEC 60191-6-2 Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages;
IEC 60191-6-5 Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine-pitch ball grid array (FBGA)
IEC 60194 Printed board design, manufacture and assembly - Terms and definitions*， 2015-04-01 Update
IEC 61190-1-3 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications*， 2017-12-13 Update
IEC 61249-2-7 Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad; Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad
IEC 61249-2-8 Materials for printed boards and other interconnecting structures - Part 2-8: Reinforced base materials clad and unclad; Modified brominated epoxide woven fiberglass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
BS EN 62137-4:2014 history
0000 BS EN 62137-4:2014(2015)
2015BS EN 62137-4:2014 Electronics assembly technology. Endurance test methods for solder joint of area array type package surface mount devices